<div class="content-intro"><h2>About FuriosaAI </h2> <p>FuriosaAI builds high-performance, high-efficiency AI compute for the Inference Era. Founded in 2017 by veteran semiconductor and AI algorithm engineers, Furiosa operates globally with offices in Korea and Silicon Valley, along with a compiler-focused R&amp;D lab in Lisbon.&nbsp;</p> <p>Our vision is to make AI computing sustainable, enabling access to powerful AI for everyone on Earth. We solve the AI hardware energy and operational cost crisis at the architectural level, rather than through brute force, building the world's first truly AI-native compute platform to unlock the full potential of artificial intelligence&nbsp; for every enterprise.</p></div><p></p> <h2 data-pm-slice="0 0 []">Key Responsibilities</h2> <ul> <li> <p>Define end-to-end thermal design across NPU/ASIC package → PCB → card (PCIe FHFL/HHHL, OAM, SXM) → system (server chassis) levels, selecting and designing heatsinks, heat pipes, vapor chambers, cold plates, and TIM</p> </li> <li> <p>Evaluate trade-offs across cooling approaches — air, liquid, 2-phase, and immersion — and run CFD simulations (FloTHERM, Icepak) including EM-thermal co-simulation using power maps from HFSS/SIwave/PowerDC</p> </li> <li> <p>Validate thermal performance through wind tunnel testing, hands-on temperature measurement (thermocouples, IR cameras, RTDs), and DOE-based simulation-to-measurement correlation</p> </li> <li> <p>Support reliability testing including thermal cycling and burn-in</p> </li> <li> <p>Partner with electrical, mechanical, and manufacturing teams to integrate thermal solutions into packaged hardware, and negotiate thermal specifications with OEM/ODM and hyperscale customers</p> </li> <li> <p>Author thermal design guides, reference designs, and test reports, and ensure compliance with form-factor standards (OCP OAM, PCIe CEM, NVIDIA SXM, etc.)</p> </li> </ul> <p>&nbsp;</p> <h2>Minimum Qualifications</h2> <ul> <li> <p>Thermal Modeling &amp; Simulation: Utilize computational fluid dynamics (CFD) to simulate heat transfer and fluid flow.</p> </li> <li> <p>System Design: Design active and passive cooling solutions, including heatsinks, fans, liquid cooling coldplate.</p> </li> <li> <p>Thermal Testing: Evaluation for NPU card thermal performance with using multi temp recorder and FLIR camera or thermocouples.</p> </li> <li> <p>Collaboration: Work closely with electrical, mechanical, and manufacturing teams to integrate thermal solutions into packaged hardware.</p> </li> </ul> <p>&nbsp;</p> <h2>Preferred Qualifications</h2> <ul> <li> <p>Experienced GPU or NPU card development or server development for datacenter</p> </li> <li> <p>Flotherm or Icepak preferred</p> </li> <li> <p>English communication for business level</p> </li> <li> <p>Positive and proactive engineer</p> </li> </ul> <p>&nbsp;</p> <h2>Job Location</h2> <ul> <li> <p>Dongtan / Seoul</p> </li> <li> <p>The primary work location for this position is Dongtan, with the option to work in either Dongtan or Seoul. Candidates who can work in Dongtan are preferred.</p> </li> </ul> <p>&nbsp;</p> <h2>Contact</h2> <ul> <li> <p>recruit@furiosa.ai</p> </li> </ul>